Richard Brook

RICHARD BROOK joined Peak International in 1991 and now serves as
President and Chief Executive Officer. He holds a B.S. in Mechanical
Engineering from the University of Saskatchewan and a M.S. in
Engineering Management from Southern Methodist University. Before
joining Peak, Mr. Brook spent nine years as an engineering major at
Texas Instruments. He holds two patents on semiconductor packaging and
wafer processing, and helped develop palladium plated lead frames which
allow for the elimination of solder from the semiconductor assembly and
test process.